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IPW60R199CPFKSA1N-Channel 600 V 16A (Tc) 139W (Tc) Through Hole PG-TO247-3-1

1:$2.6370

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ABRmicro #.ABR2045-IPW60R-1031016
MPN #.IPW60R199CPFKSA1
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In Stock: 119
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tube
Shipping DateNovember 17, 2024
* Quantity
Unit Price$ 2.6370
Ext. Price$ 2.6370
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
240$2.6370$632.9100
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
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Technical Specifications
SeriesCoolMOS™
Packaging
Tube
Lifecycle StatusNRND(Not Recommended for New Designs)
Base Product NumberIPW60R199
Continuous Drain Current (ID) @ 25°C16A (Tc)
Drain-to-Source Voltage (VDS)600 V
Drain-to-Source On Resistance (Max. Min.Rᴅs(on))10V
FET Feature-
FET TypeN-Channel
Gate Charge Total (Qg)(Max.)43 nC @ 10 V
Common Source Input Capacitance (Cɪss)(Max.)@(Vᴅs)1520 pF @ 100 V
MfrInfineon Technologies
Mounting StyleThrough Hole
Operating Temperature-55°C ~ 150°C (TJ)
Maximum Power Dissipation139W (Tc)
RDS(on) Drain-to-Source On Resistance199mOhm @ 9.9A, 10V
Package Type (Mfr.)PG-TO247-3-1
TechnologyMOSFET (Metal Oxide)
Gate-to-Source Voltage (Vɢs)±20V
VGS(th) Gate-to-Source Threshold Voltage (Max.)3.5V @ 660µA
Package / CaseTO-247-3
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Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level1 (Unlimited, ≤ 30°C/85% RH), No special packaging
REACH RegulationNo SVHCs Present
US ECCNEAR99
HTSUS8541.29.0095 (Other; No import duty applies)
Additional Details
The IPW60R199CPFKSA1 is a power semiconductor device from Infineon Technologies, specifically a N-Channel MOSFET designed for handling high voltage and current. With a voltage rating of 600 V and a current capacity of 16A at the case temperature, it delivers a substantial power handling capability of 139W. This MOSFET features a maximum threshold voltage of ±20V, and an on-resistance of 199 mOhm at 9.9A, 10V. It is encapsulated in a robust PG-TO247-3-1 through-hole package, ensuring efficient thermal management and ease of integration into electronic systems.
This information is sourced from the Internet, hasn't been reviewed, and may contain errors.