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FDZ291PP-Channel 20 V 4.6A (Ta) 1.7W (Ta) Surface Mount 9-BGA (1.5x1.6)
N/A
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ABRmicro #.ABR2045-FDZ291-1031514
ManufacturerOnsemi
MPN #.FDZ291P
Estimated Lead Time-
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DatasheetFDZ291P(PDF)
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Technical Specifications
SeriesPowerTrench®
Packaging
Tape & Reel (TR)
Lifecycle StatusObsolete
Base Product NumberFDZ29
Continuous Drain Current (ID) @ 25°C4.6A (Ta)
Drain-to-Source Voltage (VDS)20 V
Drain-to-Source On Resistance (Max. Min.Rᴅs(on))1.5V, 4.5V
FET Feature-
FET TypeP-Channel
Gate Charge Total (Qg)(Max.)13 nC @ 4.5 V
Common Source Input Capacitance (Cɪss)(Max.)@(Vᴅs)1010 pF @ 10 V
Mfronsemi
Mounting StyleSurface Mount
Operating Temperature-55°C ~ 150°C (TJ)
Maximum Power Dissipation1.7W (Ta)
RDS(on) Drain-to-Source On Resistance40mOhm @ 4.6A, 4.5V
Package Type (Mfr.)9-BGA (1.5x1.6)
TechnologyMOSFET (Metal Oxide)
Gate-to-Source Voltage (Vɢs)±8V
VGS(th) Gate-to-Source Threshold Voltage (Max.)1V @ 250µA
Package / Case9-VFBGA
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Environmental Information
Environmental & Export Classifications
MSL Level1 (Unlimited, ≤ 30°C/85% RH), No special packaging
REACH RegulationNo SVHCs Present
US ECCNEAR99
HTSUS8541.29.0095 (Other; No import duty applies)
Additional Details
The FDZ291P is a P-Channel MOSFET manufactured by Onsemi, designed for surface mount applications. It features a maximum drain-source voltage of 20 V and can handle a continuous drain current of 4.6A at a given thermal rating. The device supports a power dissipation of 1.7W and is housed in a compact 9-BGA package measuring 1.5 x 1.6 mm. Its gate charge is rated at 13 nC at a gate-source voltage of 4.5 V, with a threshold voltage range allowing for operation at 1.5V and 4.5V. Additionally, it can withstand gate-source voltage spikes of up to ±8V, making it suitable for various electronic switching functions where space and power efficiency are priorities.
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