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FDMS2572N-Channel 150 V 4.5A (Ta), 27A (Tc) 2.5W (Ta), 78W (Tc) Surface Mount 8-MLP (5x6), Power56

1:$1.9550

Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR2045-FDMS25-912251
ManufacturerOnsemi
MPN #.FDMS2572
Estimated Lead Time32 Weeks
SampleGet Free Sample
DatasheetDatasheetFDMS2572(PDF)
For large-volume purchases, our unique channels enable us to provide prices that other suppliers cannot match: significantly below market rates.
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In Stock: 4200
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tape & Reel (TR)Cut Tape (CT)Abrmicro® Custom Packaging
Shipping DateNovember 13, 2024
* Quantity
Unit Price$ 1.9550
Ext. Price$ 1.9550
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
1$1.9550$1.9550
10$1.6250$16.2500
100$1.2930$129.3000
500$1.0950$547.5000
1000$0.9280$928.0000
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
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Technical Specifications
SeriesUltraFET™
Packaging
Tape & Reel (TR)
Cut Tape (CT)
Abrmicro® Custom Packaging
Lifecycle StatusActive
Base Product NumberFDMS25
Continuous Drain Current (ID) @ 25°C4.5A (Ta), 27A (Tc)
Drain-to-Source Voltage (VDS)150 V
Drain-to-Source On Resistance (Max. Min.Rᴅs(on))6V, 10V
FET Feature-
FET TypeN-Channel
Gate Charge Total (Qg)(Max.)43 nC @ 10 V
Common Source Input Capacitance (Cɪss)(Max.)@(Vᴅs)2610 pF @ 75 V
Mfronsemi
Mounting StyleSurface Mount
Operating Temperature-55°C ~ 150°C (TJ)
Maximum Power Dissipation2.5W (Ta), 78W (Tc)
RDS(on) Drain-to-Source On Resistance47mOhm @ 4.5A, 10V
Package Type (Mfr.)8-MLP (5x6), Power56
TechnologyMOSFET (Metal Oxide)
Gate-to-Source Voltage (Vɢs)±20V
VGS(th) Gate-to-Source Threshold Voltage (Max.)4V @ 250µA
Package / Case8-PowerWDFN
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
Extended Links
Datasheets
FDMS2572
Environmental Information
Material Declaration FDMS2572onsemi REACHonsemi RoHS
PCN Assembly/Origin
FDMyy A/T Chgs 20/Oct/2021
PCN Design/Specification
FDMS Wire Bond Material 16/May/2007Logo 17/Aug/2017
PCN Packaging
Mult Devices 24/Oct/2017
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level1 (Unlimited, ≤ 30°C/85% RH), No special packaging
REACH RegulationNo SVHCs Present
US ECCNEAR99
HTSUS8541.29.0095 (Other; No import duty applies)