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OMAPL138EZCEA3ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (13x13)
1:$20.7100
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ABRmicro #.ABR694-OMAPL1-322043
ManufacturerTexas Instruments
MPN #.OMAPL138EZCEA3
Estimated Lead Time18 Weeks
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DatasheetOMAP-L138 Datas... (PDF)
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In Stock: 136
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 24, 2024
* Quantity
Unit Price$20.7100
Ext. Price$20.7100
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
160$20.7100$3313.6400
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesOMAP-L1x
Packaging
Tray
Lifecycle StatusActive
Additional InterfacesHPI, I2C, McASP, McBSP, MMC/SD, SPI, UART
Base Product NumberOMAPL138
Specialized Processors (Co-Processors/DSP)Signal Processing; C674x, System Control; CP15
Core ProcessorARM926EJ-S
Display & Interface ControllersLCD
Ethernet10/100Mbps (1)
Graphics AccelerationNo
Mounting StyleSurface Mount
Number of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)
RAM ControllersSDRAM
Serial ATASATA 3Gbps (1)
Security FeaturesBoot Security, Cryptography
Speed375MHz
Package Type (Mfr.)361-NFBGA (13x13)
USB InterfacesUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
I/O Operating Voltage1.8V, 3.3V
Package / Case361-LFBGA
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
Extended Links
Datasheets
Errata
Manuals
Manufacturer Product Page
PCN Assembly/Origin
PCN Design/Specification
PCN Packaging
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN3A991A2 AT
HTSUS8542.31.0001 (No rates found in the Harmonized Tariff Schedule)
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The OMAPL138EZCEA3 is a microprocessor integrated circuit developed by Texas Instruments, based on the ARM926EJ-S architecture. It features a single 32-bit core operating at a clock speed of 375MHz and is housed in a 361-ball NFBGA package with dimensions of 13x13 mm. This component supports a range of functionalities including boot security and cryptography. It also includes capabilities for interfacing with an LCD and offers Ethernet connectivity at speeds of up to 10/100Mbps.
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