MSP430F6658IZQWTMSP430 CPUXV2 MSP430F6xx Microcontroller IC 16-Bit 20MHz 384KB (384K x 8) FLASH 113-BGA Microstar Junior (7x7)
1:$7.4020
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR2012-MSP430-278542
ManufacturerTexas Instruments
MPN #.MSP430F6658IZQWT
Estimated Lead Time-
SampleGet Free Sample
Datasheet
MSP430F535/565/645/665x(PDF)
MSP430F535/565/645/665x(PDF)
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Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tape & Reel (TR)
Shipping DateNovember 3, 2024
* Quantity
Unit Price$ 7.4020
Ext. Price$ 7.4020
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
250$7.4020$1850.5000
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
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MSP430 CPUXV2 MSP430™ FRAM Microcontroller IC 16-Bit 16MHz 64KB (64K x 8) FRAM 80-LQFP (12x12) Technical Specifications
SeriesMSP430F6xx
Packaging
Tape & Reel (TR)
Lifecycle StatusObsolete
Base Product NumberMSP430F6658
Communication InterfacesI2C, IrDA, SCI, SPI, UART/USART, USB
Core ProcessorMSP430 CPUXV2
Core Size16-Bit
Data ConvertersA/D 16x12b; D/A 2x12b
EEPROM Size-
MfrTexas Instruments
Mounting StyleSurface Mount
Number of I/Os74
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeInternal
Parameter ProgrammingSupported
PeripheralsBrown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Program Memory Size384KB (384K x 8)
Program Memory TypeFLASH
RAM Size34K x 8
Speed20MHz
Package Type (Mfr.)113-BGA Microstar Junior (7x7)
Supply Voltage (Vᴄᴄ/Vᴅᴅ)1.8V ~ 3.6V
Package / Case113-VFBGA
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Datasheets
PCN Design/Specification
PCN Other
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCNEAR99
HTSUS8542.31.0001 (No rates found in the Harmonized Tariff Schedule)
Quality Inspection Records
The MSP430F6658IZQWT (IC MCU 16BIT 384KB FLASH 113BGA) passed the Photon Emission Microscopy analysis upon entering the Abrmicro warehouse on October 28, 2023. This analysis examines photon emissions from the silicon die during operation, and no defects, such as shorts or faulty transistors, were found.
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