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OMAPL137BZKB4ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 456MHz 256-BGA (17x17)
1:$23.7530
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR694-OMAPL1-404563
ManufacturerTexas Instruments
MPN #.OMAPL137BZKB4
Estimated Lead Time-
SampleGet Free Sample
DatasheetOMAP-L137 DataS... (PDF)
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In Stock: 9
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 24, 2024
* Quantity
Unit Price$23.7530
Ext. Price$23.7530
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
90$23.7530$2137.7930
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesOMAP-L1x
Packaging
Tray
Lifecycle StatusObsolete
Additional InterfacesHPI, I2C, McASP, MMC/SD, SPI, UART
Base Product NumberOMAPL137
Specialized Processors (Co-Processors/DSP)Signal Processing; C674x, System Control; CP15
Core ProcessorARM926EJ-S
Display & Interface ControllersLCD
Ethernet10/100Mbps (1)
Graphics AccelerationNo
Mounting StyleSurface Mount
Number of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 90°C (TJ)
RAM ControllersSDRAM
Serial ATA-
Security Features-
Speed456MHz
Package Type (Mfr.)256-BGA (17x17)
USB InterfacesUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
I/O Operating Voltage1.8V, 3.3V
Package / Case256-BGA
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
Extended Links
Datasheets
PCN Obsolescence/ EOL
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN3A991A2 AT
HTSUS8542.31.0001 (No rates found in the Harmonized Tariff Schedule)
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The Texas Instruments OMAPL137BZKB4 is an ARM926EJ-S based microprocessor integrated circuit featuring a single core, 32-bit processing capability with a clock speed of 456MHz. This component is housed in a compact 256-ball grid array (BGA) package measuring 17x17 mm. Designed to operate with SDRAM, the microprocessor supports voltage levels of 1.8V and 3.3V, and includes capabilities for LCD interfacing. Its architecture provides balanced performance suitable for various computing tasks within embedded systems.
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