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OMAP3530ECUSARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 600MHz 423-FCBGA (16x16)
1:$32.1260
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR694-OMAP35-286695
ManufacturerTexas Instruments
MPN #.OMAP3530ECUS
Estimated Lead Time18 Weeks
SampleGet Free Sample
DatasheetOMAP3530,25 (PDF)
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In Stock: 53
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 23, 2024
* Quantity
Unit Price$32.1260
Ext. Price$32.1260
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
1$32.1260$32.1260
10$31.5960$315.9560
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesOMAP-35xx
Packaging
Tray
Lifecycle StatusActive
Additional InterfacesHDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
Base Product NumberOMAP3530
Specialized Processors (Co-Processors/DSP)Signal Processing; C64x+, Multimedia; NEON™ SIMD
Core ProcessorARM® Cortex®-A8
Display & Interface ControllersLCD
Ethernet-
Graphics AccelerationYes
Mounting StyleSurface Mount
Number of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 90°C (TJ)
RAM ControllersLPDDR
Serial ATA-
Security Features-
Speed600MHz
Package Type (Mfr.)423-FCBGA (16x16)
USB InterfacesUSB 1.x (3), USB 2.0 (1)
I/O Operating Voltage1.8V, 3.0V
Package / Case423-LFBGA, FCBGA
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
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Datasheets
PCN Assembly/Origin
PCN Packaging
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level4 (72 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN5A992C RS,AT
HTSUS8542.31.0001 (No rates found in the Harmonized Tariff Schedule)
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The OMAP3530ECUS from Texas Instruments is a highly integrated microprocessor incorporating the ARM® Cortex®-A8 core architecture. It operates at a clock speed of 600 MHz and features a 32-bit processing capability designed to handle complex computing tasks. The chip is encapsulated in a 423-FCBGA package with dimensions of 16x16 mm. Among its functionalities are the ability to interface with LPDDR memory, execute signal processing tasks through the C64x+ DSP, and perform multimedia processing with support for NEON™ SIMD technology. Additionally, it includes interfaces for multiple USB connections, with three supporting USB 1.x standards and one compatible with USB 2.0, allowing for a range of device connectivity options.
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