AM5726BABCXARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)
1:$51.1010
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ABRmicro #.ABR694-AM5726-299373
ManufacturerTexas Instruments
MPN #.AM5726BABCX
Estimated Lead Time18 Weeks
SampleGet Free Sample
Datasheet
AM5726, AM5728,... (PDF)
AM5726, AM5728,... (PDF)
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Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 23, 2024
* Quantity
Unit Price$51.1010
Ext. Price$51.1010
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
60$51.1010$3066.0560
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesSitara™
Packaging
Tray
Lifecycle StatusActive
Additional InterfacesCAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
Base Product NumberAM5726
Specialized Processors (Co-Processors/DSP)DSP, IPU, VPE
Core ProcessorARM® Cortex®-A15
Display & Interface Controllers-
EthernetGbE
Graphics AccelerationNo
Mounting StyleSurface Mount
Number of Cores/Bus Width2 Core, 32-Bit
Operating Temperature0°C ~ 90°C (TJ)
RAM ControllersDDR3, SRAM
Serial ATASATA 3Gbps (1)
Security Features-
Speed1.5GHz
Package Type (Mfr.)760-FCBGA (23x23)
USB InterfacesUSB 2.0 (1), USB 3.0 (1)
I/O Operating Voltage1.8V, 3.3V
Package / Case760-BFBGA, FCBGA
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PCN Assembly/Origin
PCN Design/Specification
PCN Packaging
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN5A992C RS,AT
HTSUS8542.31.0001 (No rates found in the Harmonized Tariff Schedule)
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The AM5726BABCX is a microprocessor IC from Texas Instruments featuring a dual-core ARM Cortex-A15 architecture, designed for high-performance computing tasks. It operates at a clock speed of 1.5GHz and comes in a 760-ball Fine-Pitch Ball Grid Array (FCBGA) package measuring 23x23 mm. This processor supports DDR3 and has integrated Static RAM (SRAM) for flexible memory configurations. It includes multimedia processing capabilities with its DSP, IPU, and Video Processing Engine (VPE) units, and offers connectivity options through USB 2.0 and USB 3.0 interfaces, making it suitable for a variety of embedded system applications.
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