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AM3356BZCEA60ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 298-NFBGA (13x13)
1:$9.2070
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR694-AM3356-299652
ManufacturerTexas Instruments
MPN #.AM3356BZCEA60
Estimated Lead Time18 Weeks
SampleGet Free Sample
DatasheetAM335x Datashee... (PDF)
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In Stock: 87
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 23, 2024
* Quantity
Unit Price$9.2070
Ext. Price$9.2070
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
160$9.2070$1473.0500
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesSitara™
Packaging
Tray
Lifecycle StatusActive
Additional InterfacesCAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
Base Product NumberAM3356
Specialized Processors (Co-Processors/DSP)Multimedia; NEON™ SIMD
Core ProcessorARM® Cortex®-A8
Display & Interface ControllersLCD, Touchscreen
Ethernet10/100/1000Mbps (2)
Graphics AccelerationYes
Mounting StyleSurface Mount
Number of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)
RAM ControllersLPDDR, DDR2, DDR3, DDR3L
Serial ATA-
Security FeaturesCryptography, Random Number Generator
Speed600MHz
Package Type (Mfr.)298-NFBGA (13x13)
USB InterfacesUSB 2.0 + PHY (2)
I/O Operating Voltage1.8V, 3.3V
Package / Case298-LFBGA
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
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PCN Assembly/Origin
PCN Design/Specification
PCN Packaging
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN5A992C RS,AT
HTSUS8542.31.0001 (No rates found in the Harmonized Tariff Schedule)
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The AM3356BZCEA60 is a microprocessor from Texas Instruments' Sitara™ series, featuring a 32-bit ARM® Cortex®-A8 core operating at 600MHz. It is housed in a 298-ball NFBGA package that measures 13x13 mm. The part integrates USB 2.0 interfaces with an on-chip physical layer (PHY), operates at core voltages of 1.8V and I/O voltages of 3.3V, and supports display functionalities including LCD and touchscreen interfaces. This microprocessor is designed to handle a range of complex computations and data processing tasks efficiently in embedded systems.
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