AM3351BZCEA60ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 298-NFBGA (13x13)
1:$10.2150
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR694-AM3351-391729
ManufacturerTexas Instruments
MPN #.AM3351BZCEA60
Estimated Lead Time18 Weeks
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Datasheet
AM335x Datashee... (PDF)
AM335x Datashee... (PDF)
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Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 24, 2024
* Quantity
Unit Price$10.2150
Ext. Price$10.2150
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
1$10.2150$10.2150
10$9.3860$93.8610
25$8.9970$224.9310
160$7.9270$1268.3700
320$7.5380$2412.3000
480$7.0520$3384.8700
960$6.4690$6209.7600
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesSitara™
Packaging
Tray
Lifecycle StatusActive
Additional InterfacesI2C, McASP, McSPI, MMC/SD/SDIO, UART
Base Product NumberAM3351
Specialized Processors (Co-Processors/DSP)Multimedia; NEON™ SIMD
Core ProcessorARM® Cortex®-A8
Display & Interface ControllersLCD, Touchscreen
Ethernet10/100/1000Mbps (1)
Graphics AccelerationYes
Mounting StyleSurface Mount
Number of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)
RAM ControllersLPDDR, DDR2, DDR3, DDR3L
Serial ATA-
Security FeaturesCryptography, Random Number Generator
Speed600MHz
Package Type (Mfr.)298-NFBGA (13x13)
USB InterfacesUSB 2.0 + PHY (1)
I/O Operating Voltage1.8V, 3.3V
Package / Case298-LFBGA
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Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN5A992C RS,AT
HTSUS8542.31.0001 (No rates found in the Harmonized Tariff Schedule)
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The AM3351BZCEA60 is a microprocessor integrated circuit developed by Texas Instruments, featuring an ARM® Cortex®-A8 core. This 32-bit processor operates at a clock speed of 600MHz and is housed in a compact 298-ball NFBGA package, measuring 13mm by 13mm. Designed for versatile connectivity and processing requirements, the chip includes cryptographic and random number generation capabilities, and supports a variety of communication protocols such as 10/100/1000Mbps Ethernet, I2C, McASP, McSPI, MMC/SD/SDIO, and UART. This integration makes it suitable for various embedded systems requiring reliable processing and connectivity features.
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