74LVX273TTRFlip Flop 1 Element D-Type 8 Bit Positive Edge 20-TSSOP (0.173", 4.40mm Width)
1:$0.8770
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR2019-74LVX2-1184098
ManufacturerSTMicroelectronics
MPN #.74LVX273TTR
Estimated Lead Time-
SampleGet Free Sample
Datasheet
74LVX273(PDF)
74LVX273(PDF)
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Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tape & Reel (TR)Cut Tape (CT)Abrmicro® Custom Packaging
Shipping DateNovember 6, 2024
* Quantity
Unit Price$ 0.8770
Ext. Price$ 0.8770
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
1$0.8770$0.8770
10$0.7810$7.8100
25$0.7420$18.5500
100$0.6090$60.9000
250$0.5700$142.5000
500$0.5030$251.5000
1000$0.3970$397.0000
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Related Parts
M74HC126TTRN/A
Buffer, Non-Inverting 4 Element 1 Bit per Element 3-State Output 14-TSSOP
Technical Specifications
Series74LVX
Packaging
Tape & Reel (TR)
Cut Tape (CT)
Abrmicro® Custom Packaging
Lifecycle StatusObsolete
Base Product Number74LVX273
Clock Frequency90 MHz
Output Current (High, Low)4mA, 4mA
Current - Quiescent (Iq)4 µA
FunctionMaster Reset
Input Capacitance5 pF
Propagation Delay (Max.)@ (Vᴄᴄ)(ᴄʟ)14.5ns @ 3.3V, 50pF
Mounting StyleSurface Mount
Number of Bits per Element8
Number of Elements1
Operating Temperature-55°C ~ 125°C (TA)
Output TypeNon-Inverted
Package Type (Mfr.)20-TSSOP
Trigger TypePositive Edge
TypeD-Type
Supply Voltage2V ~ 3.6V
Package / Case20-TSSOP (0.173", 4.40mm Width)
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Datasheets
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level1 (Unlimited, ≤ 30°C/85% RH), No special packaging
REACH RegulationNo SVHCs Present
US ECCNEAR99
HTSUS8542.39.0060 (Other; No import duty applies)
Quality Inspection Records
The 74LVX273TTR (IC FF D-TYPE SNGL 8BIT 20TSSOP) passed the final packaging and label inspection upon entering the Abrmicro warehouse on September 14, 2023. Ensure that the IC is labeled and packaged according to specifications and standards.
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