COP8SCR9HLQ8COP8 COP8™ 8S Microcontroller IC 8-Bit 20MHz 32KB (32K x 8) FLASH 44-WQFN (7x7)
1:$1.3730
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR685-COP8SC-933849
ManufacturerNational Semiconductor
MPN #.COP8SCR9HLQ8
Estimated Lead Time-
SampleGet Free Sample
Datasheet
COP8SCR9KMT8 (PDF)
COP8SCR9KMT8 (PDF)
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Guaranteed AuthenticityTechnical SupportFast RefundFree Shipping (over $960)Issue an Invoice24/7 Manual Service In Stock: 2450
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Bulk
Shipping DateDecember 24, 2024
* Quantity
Unit Price$1.3730
Ext. Price$1.3730
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
166$1.3730$227.8770
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesCOP8™ 8S
Packaging
Bulk
Lifecycle StatusObsolete
Base Product NumberCOP8SCR9
Communication InterfacesMicrowire/Plus (SPI), UART/USART
Core ProcessorCOP8
Core Size8-Bit
Data Converters-
EEPROM Size-
MfrNational Semiconductor
Mounting StyleSurface Mount
Number of I/Os37
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeInternal
Parameter ProgrammingSupported
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
Program Memory Size32KB (32K x 8)
Program Memory TypeFLASH
RAM Size1K x 8
Speed20MHz
Package Type (Mfr.)44-WQFN (7x7)
Supply Voltage (Vᴄᴄ/Vᴅᴅ)2.7V ~ 5.5V
Package / Case44-WFQFN Exposed Pad
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Datasheets
Environmental & Export Classifications
RoHS ComplianceNot RoHS compliant and cannot enter the EU market
US ECCNEAR99
HTSUS8542.31.0001 (No rates found in the Harmonized Tariff Schedule)
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COP8 COP8™ 8S Microcontroller IC 8-Bit 20MHz 32KB (32K x 8) FLASH 56-TSSOP Quality Inspection Records
The COP8SCR9HLQ8 (IC MCU 8BIT 32KB FLASH 44WQFN) passed the X-ray inspection upon entering the Abrmicro warehouse on June 9, 2024. This method examines the internal structure of the microcontroller for defects such as wire bonding issues, die defects, or problems in the encapsulation process, and none were found.
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