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A2F060M3E-1FG256ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 100MHz 256-FPBGA (17x17)
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ABRmicro #.ABR777-A2F060-908062
ManufacturerMicrosemi
MPN #.A2F060M3E-1FG256
Estimated Lead Time-
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DatasheetSmartFusion cSo... (PDF)
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In Stock: 15
Shipped From Shenzhen or Hong Kong Warehouses
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Packaging
Tray
Shipping DateDecember 23, 2024
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Technical Specifications
SeriesSmartFusion®
Packaging
Tray
Lifecycle StatusObsolete
ArchitectureMCU, FPGA
Base Product NumberA2F060M3E
Communication InterfacesEBI/EMI, I2C, SPI, UART/USART
Core ProcessorARM® Cortex®-M3
Flash Size128KB
Number of I/OsMCU - 26, FPGA - 66
Operating Temperature0°C ~ 85°C (TJ)
PeripheralsDMA, POR, WDT
Primary AttributesProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
RAM Size16KB
Speed100MHz
Package Type (Mfr.)256-FPBGA (17x17)
Package / Case256-LBGA
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Environmental Information
PCN Assembly/Origin
PCN Design/Specification
PCN Obsolescence/ EOL
PCN Other
Environmental & Export Classifications
RoHS ComplianceNot RoHS compliant and cannot enter the EU market
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN3A991D AT
HTSUS8542.39.0001 (No rates found in the Harmonized Tariff Schedule)
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Additional Details
The A2F060M3E-1FG256 is a System on Chip (SoC) from Microsemi, featuring an ARM Cortex-M3 core running at 100 MHz. It integrates a ProASIC3 FPGA, providing 60,000 gates and 1,536 D-flip-flops, making it suitable for custom logic and embedded applications. The device comes in a 256-ball Fine Pitch Ball Grid Array (FPBGA) package, measuring 17x17mm, and offers a combination of high processing performance and flexibility for applications in areas like communications, industrial control, and consumer electronics. The combination of an ARM Cortex-M3 processor and FPGA fabric allows for efficient, high-performance solutions with customizable logic and peripherals.
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