A2F200M3F-1CSG288IARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 100MHz 288-CSP (11x11)
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ABRmicro #.ABR777-A2F200-920909
ManufacturerMicrochip Technology
MPN #.A2F200M3F-1CSG288I
Estimated Lead Time-
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Datasheet
SmartFusion cSo... (PDF)
SmartFusion cSo... (PDF)
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Packaging
Tray
Shipping DateDecember 23, 2024
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Technical Specifications
SeriesSmartFusion®
Packaging
Tray
Lifecycle StatusActive
ArchitectureMCU, FPGA
Base Product NumberA2F200
Communication InterfacesEBI/EMI, Ethernet, I2C, SPI, UART/USART
Core ProcessorARM® Cortex®-M3
Flash Size256KB
Number of I/OsMCU - 31, FPGA - 78
Operating Temperature-40°C ~ 100°C (TJ)
PeripheralsDMA, POR, WDT
Primary AttributesProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
RAM Size64KB
Speed100MHz
Package Type (Mfr.)288-CSP (11x11)
Package / Case288-TFBGA, CSPBGA
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PCN Assembly/Origin
PCN Design/Specification
PCN Obsolescence/ EOL
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Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN3A991D AT
HTSUS8542.39.0001 (No rates found in the Harmonized Tariff Schedule)
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