PIC16C774T-I/PQPIC PIC® 16C Microcontroller IC 8-Bit 20MHz 7KB (4K x 14) OTP 44-MQFP (10x10)
1:$5.9200
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR2012-PIC16C-277884
ManufacturerMicrochip Technology
MPN #.PIC16C774T-I/PQ
Estimated Lead Time-
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Datasheet
MPLAB® ICE2000 Spec(PDF)
MPLAB® ICE2000 Spec(PDF)
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Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tape & Reel (TR)
Shipping DateNovember 3, 2024
* Quantity
Unit Price$ 5.9200
Ext. Price$ 5.9200
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
900$5.9200$5328.0000
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
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PIC PIC® XLP™ 16F Microcontroller IC 8-Bit 48MHz 14KB (8K x 14) FLASH 14-TSSOP Technical Specifications
SeriesPIC® 16C
Packaging
Tape & Reel (TR)
Lifecycle StatusObsolete
Base Product NumberPIC16C774
Communication InterfacesI2C, SPI, UART/USART
Core ProcessorPIC
Core Size8-Bit
Data ConvertersA/D 10x12b
EEPROM Size-
MfrMicrochip Technology
Mounting StyleSurface Mount
Number of I/Os33
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeExternal
Parameter ProgrammingSupported
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
Program Memory Size7KB (4K x 14)
Program Memory TypeOTP
RAM Size256 x 8
Speed20MHz
Package Type (Mfr.)44-MQFP (10x10)
Supply Voltage (Vᴄᴄ/Vᴅᴅ)4V ~ 5.5V
Package / Case44-QFP
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Environmental Information
Other Related Documents
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCNEAR99
HTSUS8542.31.0001 (No rates found in the Harmonized Tariff Schedule)
Quality Inspection Records
The PIC16C774T-I/PQ (IC MCU 8BIT 7KB OTP 44MQFP) passed the Thermal Cycling Testing upon entering the Abrmicro warehouse on March 13, 2024. The microcontroller was exposed to repeated cycles of extreme temperature variations, demonstrating strong durability under stress, with no thermal-related failures observed.
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