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CYW20704UA1KFFB1GIC RF TxRx + MCU Bluetooth Bluetooth v4.1 2.4GHz 49-VFBGA, FCBGA
1:$2.5380
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR879-CYW207-906782
ManufacturerInfineon Technologies
MPN #.CYW20704UA1KFFB1G
Estimated Lead Time13 Weeks
SampleGet Free Sample
DatasheetCYW20704(PDF)
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In Stock: 99
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateNovember 3, 2024
* Quantity
Unit Price$ 2.5380
Ext. Price$ 2.5380
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
4900$2.5380$12436.2000
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
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IC RF TxRx + MCU WiFi 802.11b/g/n 2.4GHz 56-VFQFN Exposed Pad Technical Specifications
Series-
Packaging
Tray
Lifecycle StatusActive
Base Product NumberCYW20704
Supply Current@Receive Mode-
Transmission Current-
Data Rate (Max)2Mbps
Frequency2.4GHz
GPIO8
Memory Size-
MfrInfineon Technologies
Modulation-
Mounting StyleSurface Mount
Operating Temperature-30°C ~ 85°C
Parameter ProgrammingSupported
Output Power12dBm
ProtocolBluetooth v4.1
RF Family/StandardBluetooth
Sensitivity-95.5dBm
Serial InterfacesSPI, UART
Package Type (Mfr.)49-FCBGA (4.5x4)
TypeTxRx + MCU
Supply Voltage3.3V
Package / Case49-VFBGA, FCBGA
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
Extended Links
Datasheets
Environmental Information
Other Related Documents
PCN Design/Specification
PCN Packaging
PCN Part Status Change
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN5A992C RS,AT
HTSUS8542.39.0001 (No rates found in the Harmonized Tariff Schedule)
Quality Inspection Records
The CYW20704UA1KFFB1G (IC RF TXRX+MCU BLE 49FCBGA) passed the Scanning Electron Microscopy inspection upon entering the Abrmicro warehouse on November 11, 2023. Detailed imaging revealed no cracks or material defects.
Abrmicro Engineering