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HDG104-DN-2IC RF TxRx + MCU WiFi 802.11b/g 2.4GHz 44-LQFN Exposed Pad Module

1:$22.4440

Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR879-HDG104-1355696
ManufacturerH&D Wireless AB
MPN #.HDG104-DN-2
Estimated Lead Time-
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In Stock: 78
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tape & Reel (TR)Cut Tape (CT)
Shipping DateNovember 3, 2024
* Quantity
Unit Price$ 22.4440
Ext. Price$ 22.4440
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
1$22.4440$22.4440
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Related Parts
HDG204-DN-3$31.7520
IC RF TxRx Only WiFi 802.11b/g 2.4GHz ~ 2.5GHz 44-TQFN Exposed Pad Module
Technical Specifications
Series-
Packaging
Tape & Reel (TR)
Cut Tape (CT)
Lifecycle StatusActive
Base Product NumberHDG104
Supply Current@Receive Mode60mA
Transmission Current15mA
Data Rate (Max)54Mbps
Frequency2.4GHz
Memory Size1kB EEPROM, 160kB SRAM
MfrH&D Wireless AB
Modulation16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK
Mounting StyleSurface Mount
Operating Temperature-20°C ~ 70°C
Parameter ProgrammingSupported
Output Power17dBm
Protocol802.11b/g
RF Family/StandardWiFi
Sensitivity-96dBm
Serial InterfacesSDIO, SPI, UART
Package Type (Mfr.)44-QFN SIP (7.7x7.1)
TypeTxRx + MCU
Supply Voltage2.75V ~ 3.6V
Package / Case44-LQFN Exposed Pad Module
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level6 (Time on Label, ≤ 30°C/60% RH), Mandatory bake before use and after exposure, Multi-layer protective packaging
US ECCN5A992C RS,AT
HTSUS8517.79.0000 (Other; Unit of Quantity [No.]; General duty rate 'FREE'; Non-NTR country duty rate '35%')
Quality Inspection Records
The HDG104-DN-2 (IC RF TXRX+MCU WIFI 44QFN) passed the visual inspection upon entering the Abrmicro warehouse on July 22, 2024. Microscopes or AOI systems were used to visually inspect the IC's surface and solder joints, and no common defects were found.
Abrmicro Laboratory