EPC2007N-Channel 100 V 6A (Ta) Surface Mount Die
N/A
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ABRmicro #.ABR278-EPC200-1179002
ManufacturerEPC (Efficient Power Conversion)
MPN #.EPC2007
Estimated Lead Time-
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Datasheet
EPC2007 (PDF)
EPC2007 (PDF)
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Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tape & Reel (TR)
Shipping DateDecember 24, 2024
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Technical Specifications
SerieseGaN®
Packaging
Tape & Reel (TR)
Lifecycle StatusObsolete
Base Product NumberEPC20
Continuous Drain Current (ID) @ 25°C6A (Ta)
Drain-to-Source Voltage (VDS)100 V
Drain-to-Source On Resistance (Max. Min.Rᴅs(on))5V
FET Feature-
FET TypeN-Channel
Gate Charge Total (Qg)(Max.)2.8 nC @ 5 V
Common Source Input Capacitance (Cɪss)(Max.)@(Vᴅs)205 pF @ 50 V
MfrEPC
Mounting StyleSurface Mount
Operating Temperature-40°C ~ 125°C (TJ)
Maximum Power Dissipation-
RDS(on) Drain-to-Source On Resistance30mOhm @ 6A, 5V
Package Type (Mfr.)Die
TechnologyGaNFET (Gallium Nitride)
Gate-to-Source Voltage (Vɢs)+6V, -5V
VGS(th) Gate-to-Source Threshold Voltage (Max.)2.5V @ 1.2mA
Package / CaseDie
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Datasheets
Environmental Information
PCN Assembly/Origin
PCN Design/Specification
PCN Obsolescence/ EOL
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level1 (Unlimited, ≤ 30°C/85% RH), No special packaging
REACH RegulationNo SVHCs Present
US ECCNEAR99
HTSUS8541.29.0040 (Unmounted chips, dice and wafers; No import duty applies)
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