XCZU6EG-2FFVB1156IQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)
1:$3967.5540
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR777-XCZU6E-946236
ManufacturerAMD
MPN #.XCZU6EG-2FFVB1156I
Estimated Lead Time16 Weeks
SampleGet Free Sample
Datasheet
UltraScale™ Arc... (PDF)
UltraScale™ Arc... (PDF)
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Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 24, 2024
* Quantity
Unit Price$3967.5540
Ext. Price$3967.5540
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Price Gradients
Qty.Unit PriceExt. Price
1$3967.5540$3967.5540
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesZynq® UltraScale+™ MPSoC EG
Packaging
Tray
Lifecycle StatusActive
ArchitectureMCU, FPGA
Base Product NumberXCZU6
Communication InterfacesCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size-
Number of I/Os328
Operating Temperature-40°C ~ 100°C (TJ)
PeripheralsDMA, WDT
Primary AttributesZynq®UltraScale+™ FPGA, 469K+ Logic Cells
RAM Size256KB
Speed533MHz, 600MHz, 1.3GHz
Package Type (Mfr.)1156-FCBGA (35x35)
Package / Case1156-BBGA, FCBGA
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Environmental Information
PCN Design/Specification
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level4 (72 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN5A002A4 NS,RS,AT,EI
HTSUS8542.39.0001 (No rates found in the Harmonized Tariff Schedule)
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