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XCZU3CG-2UBVA530IDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC - Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 533MHz, 1.3GHz 530-FCBGA (16x9.5)

1:$600.6900

Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR777-XCZU3C-2316390
ManufacturerAMD
MPN #.XCZU3CG-2UBVA530I
Estimated Lead Time26 Weeks
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In Stock: 5
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 24, 2024
* Quantity
Unit Price$600.6900
Ext. Price$600.6900
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Qty.Unit PriceExt. Price
1$600.6900$600.6900
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
Series-
Packaging
Tray
Lifecycle StatusActive
ArchitectureMPU, FPGA
Communication InterfacesCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size-
Number of I/Os82
Operating Temperature-40°C ~ 100°C (TJ)
PeripheralsDMA, WDT
Primary AttributesZynq®UltraScale+™ FPGA, 154K+ Logic Cells
RAM Size256KB
Speed533MHz, 1.3GHz
Package Type (Mfr.)530-FCBGA (16x9.5)
Package / Case530-WFBGA, FCBGA
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
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Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
HTSUS8542.31.0070 (System on chip (SoCs); No import duty applies)
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