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XCKU3P-2FFVA676IKintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 256 31641600 355950 676-BBGA, FCBGA

1:$1987.5180

Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR696-XCKU3P-913519
ManufacturerAMD
MPN #.XCKU3P-2FFVA676I
Estimated Lead Time16 Weeks
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In Stock: 103
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 23, 2024
* Quantity
Unit Price$1987.5180
Ext. Price$1987.5180
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
1$1987.5180$1987.5180
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesKintex® UltraScale+™
Packaging
Tray
Lifecycle StatusActive
Base Product NumberXCKU3
MfrAMD
Mounting StyleSurface Mount
Number of I/Os256
Number of LABs/CLBs20340
Number of Logic Elements/Cells355950
Operating Temperature-40°C ~ 100°C (TJ)
Parameter ProgrammingSupported
Package Type (Mfr.)676-FCBGA (27x27)
Total RAM Bits31641600
Supply Voltage0.825V ~ 0.876V
Package / Case676-BBGA, FCBGA
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
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Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level4 (72 Hours, ≤ 30°C/60% RH), Vacuum Sealing
US ECCN3A991D AT
HTSUS8542.39.0001 (No rates found in the Harmonized Tariff Schedule)
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