XC7Z045-2FFG676IDual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 800MHz 676-FCBGA (27x27)
1:$2293.7460
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR777-XC7Z04-1003470
ManufacturerAMD
MPN #.XC7Z045-2FFG676I
Estimated Lead Time16 Weeks
SampleGet Free Sample
Datasheet
XC7Z030,35,45,1... (PDF)
XC7Z030,35,45,1... (PDF)
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Guaranteed AuthenticityTechnical SupportFast RefundFree Shipping (over $960)Issue an Invoice24/7 Manual Service In Stock: 68
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 24, 2024
* Quantity
Unit Price$2293.7460
Ext. Price$2293.7460
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
1$2293.7460$2293.7460
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesZynq®-7000
Packaging
Tray
Lifecycle StatusActive
ArchitectureMCU, FPGA
Base Product NumberXC7Z045
Communication InterfacesCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
Number of I/Os130
Operating Temperature-40°C ~ 100°C (TJ)
PeripheralsDMA
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
RAM Size256KB
Speed800MHz
Package Type (Mfr.)676-FCBGA (27x27)
Package / Case676-BBGA, FCBGA
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Environmental Information
Errata
PCN Design/Specification
PCN Packaging
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level4 (72 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN3A991D AT
HTSUS8542.39.0060 (Other; No import duty applies)
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