XAZU3EG-1SFVC784QQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 500MHz, 1.2GHz 784-FCBGA (23x23)
1:$1029.0630
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR777-XAZU3E-922581
ManufacturerAMD
MPN #.XAZU3EG-1SFVC784Q
Estimated Lead Time16 Weeks
SampleGet Free Sample
Datasheet
XA Zynq UltraSc... (PDF)
XA Zynq UltraSc... (PDF)
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Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 23, 2024
* Quantity
Unit Price$1029.0630
Ext. Price$1029.0630
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
1$1029.0630$1029.0630
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesZynq® UltraScale+™ MPSoC EG
Packaging
Tray
Lifecycle StatusActive
ArchitectureMPU, FPGA
Base Product NumberXAZU3
Communication InterfacesCANbus, I2C, SPI, UART/USART, USB
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size-
Number of I/Os128
Operating Temperature-40°C ~ 125°C (TJ)
PeripheralsDMA, WDT
Primary AttributesZynq®UltraScale+™ FPGA, 154K+ Logic Cells
RAM Size1.8MB
Speed500MHz, 1.2GHz
Package Type (Mfr.)784-FCBGA (23x23)
Package / Case784-BFBGA, FCBGA
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Datasheets
Environmental Information
PCN Design/Specification
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level4 (72 Hours, ≤ 30°C/60% RH), Vacuum Sealing
US ECCN5A002A4 NS,RS,AT,EI
HTSUS8542.39.0001 (No rates found in the Harmonized Tariff Schedule)
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