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Z8F0123QB005SGeZ8 Encore!® XP® Microcontroller IC 8-Bit 5MHz 1KB (1K x 8) FLASH 8-QFN (5x6)
1:$1.3090
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR685-Z8F012-904751
ManufacturerZilog®
MPN #.Z8F0123QB005SG
Estimated Lead Time-
SampleGet Free Sample
DatasheetZ8 Encore! XP F... (PDF)
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In Stock: 35
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 24, 2024
* Quantity
Unit Price$1.3090
Ext. Price$1.3090
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
4410$1.3090$5772.6900
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesEncore!® XP®
Packaging
Tray
Lifecycle StatusActive
Base Product NumberZ8F0123
Communication InterfacesIrDA, UART/USART
Core ProcessoreZ8
Core Size8-Bit
Data ConvertersA/D 4x10b
EEPROM Size-
MfrZilog
Mounting StyleSurface Mount
Number of I/Os6
Operating Temperature0°C ~ 70°C (TA)
Oscillator TypeInternal
Parameter ProgrammingSupported
PeripheralsBrown-out Detect/Reset, LED, POR, PWM, WDT
Program Memory Size1KB (1K x 8)
Program Memory TypeFLASH
RAM Size256 x 8
Speed5MHz
Package Type (Mfr.)8-QFN (5x6)
Supply Voltage (Vᴄᴄ/Vᴅᴅ)2.7V ~ 3.6V
Package / Case8-VDFN Exposed Pad
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
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Datasheets
Environmental Information
PCN Assembly/Origin
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCNEAR99
HTSUS8542.31.0001 (No rates found in the Harmonized Tariff Schedule)
Related Parts
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eZ8 Encore!® XP® Microcontroller IC 8-Bit 20MHz 2KB (2K x 8) FLASH 28-SSOP Quality Inspection Records
The Z8F0123QB005SG (IC MCU 8BIT 1KB FLASH 8QFN) passed the Laser-Induced Imaging test upon entering the Abrmicro warehouse on November 25, 2023. The test, which detects variations in the internal structure by scanning the die with a laser, found no defects.
Abrmicro Engineering