SIC639ACD-T1-GE3Half Bridge (2) Driver Synchronous Buck Converters Power MOSFET PowerPAK® MLP55-31L
1:$2.2990
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR746-SIC639-94455
ManufacturerVishay Siliconix
MPN #.SIC639ACD-T1-GE3
Estimated Lead Time17 Weeks
SampleGet Free Sample
Datasheet
SIC639 (PDF)
SIC639 (PDF)
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Service
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Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tape & Reel (TR)Cut Tape (CT)Abrmicro® Custom Packaging
Shipping DateDecember 24, 2024
* Quantity
Unit Price$2.2990
Ext. Price$2.2990
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
1$2.2990$2.2990
10$2.0660$20.6550
25$1.9490$48.7160
100$1.6610$166.0690
250$1.5590$389.6720
500$1.3640$682.1250
1000$1.1310$1130.5000
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesVRPower®
Packaging
Tape & Reel (TR)
Cut Tape (CT)
Abrmicro® Custom Packaging
Lifecycle StatusActive
ApplicationsSynchronous Buck Converters
Base Product NumberSIC639
Output Current / Channel50A
Peak Output Current-
Fault ProtectionShoot-Through, UVLO
FeaturesBootstrap Circuit, Diode Emulation, Status Flag
InterfacePWM
Load TypeInductive, Capacitive
Mounting StyleSurface Mount
Operating Temperature-40°C ~ 125°C (TA)
Output ConfigurationHalf Bridge (2)
Rds On (Typ)-
Package Type (Mfr.)PowerPAK® MLP55-31L
TechnologyPower MOSFET
Voltage - Load4.5V ~ 5.5V
Supply Voltage4.5V ~ 5.5V
Package / CasePowerPAK® MLP55-31L
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desire
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info@Abrmicro.comExtended Links
Datasheets
PCN Assembly/Origin
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level1 (Unlimited, ≤ 30°C/85% RH), No special packaging
US ECCNEAR99
HTSUS8542.39.0001 (No rates found in the Harmonized Tariff Schedule)
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The SIC639ACD-T1-GE3 from Vishay Siliconix is a compact power MOSFET module designed for efficient power management in synchronous buck converters. As a half-bridge driver, it integrates two MOSFETs within the PowerPAK® MLP55-31L package, ensuring a streamlined design that supports up to 50A of current. Its features include a bootstrap circuit for improved high-side drive capability, diode emulation for increased efficiency, and a status flag for fault monitoring. This part is adept at handling inductive and capacitive loads, providing a reliable solution for various power management needs.
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