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SM662PAB-BDSTFLASH - NAND (TLC) Memory IC 256Gbit eMMC 100-BGA (14x18)

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ABRmicro #.ABR774-SM662P-2236955
MPN #.SM662PAB-BDST
Estimated Lead Time-
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In Stock: 5
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 24, 2024
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Technical Specifications
SeriesFerri-eMMC®
Packaging
Tray
Lifecycle StatusObsolete
Base Product NumberSM662
Memory FormatFLASH
Memory InterfaceeMMC
Memory Organization32G x 8
Memory Size256Gbit
Memory TypeNon-Volatile
MfrSilicon Motion, Inc.
Mounting StyleSurface Mount
Operating Temperature-40°C ~ 85°C
Parameter ProgrammingSupported
Package Type (Mfr.)100-BGA (14x18)
TechnologyFLASH - NAND (TLC)
Supply Voltage-
Write Cycle Time (Twc)-
Package / Case100-LBGA
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
Extended Links
PCN Obsolescence/ EOL
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
US ECCN3A991B1A AT
HTSUS8542.32.0071 (Other; No import duty applies)
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