KHAA84901B-JC17High Bandwidth Memory (HBM) DRAM IC for AI & Server Applications, Date Code 23+,24+
1:$84.5000
Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR774-KHAA84-2949077
ManufacturerSamsung Semiconductor
MPN #.KHAA84901B-JC17
Estimated Lead Time1 Weeks
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For large-volume purchases, our unique channels enable us to provide prices that other suppliers cannot match: significantly below market rates.
Service
Guaranteed AuthenticityTechnical SupportFast RefundFree Shipping (over $960)Issue an Invoice24/7 Manual Service In Stock: 2350
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tape & Reel (TR)
Shipping DateDecember 23, 2024
* Quantity
Unit Price$84.5000
Ext. Price$84.5000
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
1$84.5000$84.5000
100$81.6200$8162.0000
500$77.4200$38710.0000
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
Packaging
Tape & Reel (TR)
Lifecycle StatusActive
Operating Temperature-40°C ~ 85°C
Density16 GB
Organization1024
Speed3.6 Gbps
Refresh32 ms
Voltage3.7A
Current2A
Package TypeMPGA
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Datasheet
Content Expansion
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
REACH RegulationNo SVHCs Present
Related Parts
Additional Details
The KHAA84901B-JC17T00 is a specific HBM2E module developed by Samsung in 2020. It is typically available in packs of 1300 pieces, with a minimum order quantity. Abrmicro has stock of this part and can ship to most countries within one week. For large orders, delivery time can be confirmed with our sales representative. Please note that this part requires a deposit or an on-site, face-to-face transaction; letters of credit are no longer accepted. For actual orders, users may apply for samples.
This information is sourced from the Internet, hasn't been reviewed, and may contain errors.