XC56309AG100AR2IC DSP 24BIT 100MHZ 144-LQFP
N/A
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ABRmicro #.ABR2012-XC5630-1173543
ManufacturerNXP Semiconductors
MPN #.XC56309AG100AR2
Estimated Lead Time-
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Datasheet
XC56309 Prod Brief(PDF)
XC56309 Prod Brief(PDF)
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Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tape & Reel (TR)
Shipping DateNovember 5, 2024
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Technical Specifications
SeriesDSP563xx
Packaging
Tape & Reel (TR)
Lifecycle StatusObsolete
Base Product NumberXC56
Clock Rate100MHz
InterfaceHost Interface, SSI, SCI
Mounting StyleSurface Mount
Non-Volatile MemoryROM (576B)
On-Chip RAM24kB
Operating Temperature-40°C ~ 105°C (TJ)
Package Type (Mfr.)144-LQFP (20x20)
TypeFixed Point
Core Voltage3.30V
I/O Operating Voltage3.30V
Package / Case144-LQFP
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Datasheets
Environmental Information
PCN Packaging
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN3A991A2 AT
HTSUS8542.31.0035 (Digital signal processors (DSPs); No import duty applies)