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NX3L2267GM,1322 Circuit IC Switch 2:1 750mOhm 10-XQFN (1.55x2)
N/A
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ABRmicro #.ABR2016-NX3L22-1109048
ManufacturerNXP Semiconductors
MPN #.NX3L2267GM,132
Estimated Lead Time-
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DatasheetNX3L2267(PDF)
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Technical Specifications
Series-
Packaging
Tape & Reel (TR)
Cut Tape (CT)
Abrmicro® Custom Packaging
Lifecycle StatusObsolete
-3db Bandwidth60MHz
Base Product NumberNX3
Channel Capacitance (CS(off), CD(off))35pF
Channel-to-Channel Matching (ΔRon)90mOhm
Charge Injection37pC
Crosstalk-90dB @ 100kHz
Current - Leakage (IS(off)) (Max)10nA
Mounting StyleSurface Mount
Multiplexer/Demultiplexer Circuit2:1
Number of Circuits2
On-State Resistance (Max)750mOhm
Operating Temperature-40°C ~ 125°C (TA)
Package Type (Mfr.)10-XQFN (1.55x2)
Switch CircuitSPDT
Switch Time (Ton, Toff) (Max)40ns, 20ns
Dual Supply Voltage (V±)-
Single Supply Voltage (V+)1.4V ~ 4.3V
Package / Case10-XFQFN
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Environmental Information
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Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level1 (Unlimited, ≤ 30°C/85% RH), No special packaging
REACH RegulationNo SVHCs Present
US ECCNEAR99
HTSUS8542.39.0060 (Other; No import duty applies)