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MCIMX534AVV8C2R2ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)

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ABRmicro #.ABR2012-MCIMX5-906134
ManufacturerNXP Semiconductors
MPN #.MCIMX534AVV8C2R2
Estimated Lead Time-
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DatasheetDatasheeti.IMX53xA Datasheet(PDF)
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In Stock: 18
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tape & Reel (TR)
Shipping DateNovember 5, 2024
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Technical Specifications
Seriesi.MX53
Packaging
Tape & Reel (TR)
Lifecycle StatusObsolete
Additional Interfaces1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Base Product NumberMCIMX534
Specialized Processors (Co-Processors/DSP)Multimedia; NEON™ SIMD
Core ProcessorARM® Cortex®-A8
Display & Interface ControllersKeypad, LCD
Ethernet10/100Mbps (1)
Graphics AccelerationYes
Mounting StyleSurface Mount
Number of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)
RAM ControllersLPDDR2, DDR2, DDR3
Serial ATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHz
Package Type (Mfr.)529-FBGA (19x19)
USB InterfacesUSB 2.0 (2), USB 2.0 + PHY (2)
I/O Operating Voltage1.3V, 1.8V, 2.775V, 3.3V
Package / Case529-FBGA
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
Extended Links
Datasheets
i.IMX53xA Datasheet
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Assembly/Origin
COO/Label 15-apr-2022
PCN Obsolescence/ EOL
i.MX53 EOL 12/Feb/2021
PCN Packaging
Automated Packing Implementation 05/Jul/2023Mult Dev Pkg Seal 15/Dec/2020
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN5A992C RS,AT
HTSUS8542.31.0001 (No rates found in the Harmonized Tariff Schedule)