Image is for reference only, the actual product serves as the standard.
NCP302LSN26T1Supervisor Push-Pull, Totem Pole 1 Channel 5-TSOP

N/A

Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR2025-NCP302-2791753
ManufacturerMotorola
MPN #.NCP302LSN26T1
Estimated Lead Time-
SampleGet Free Sample
For large-volume purchases, our unique channels enable us to provide prices that other suppliers cannot match: significantly below market rates.
Service
Guaranteed Authenticity
Technical Support
Fast Refund
Free Shipping (over $960)
Issue an Invoice
24/7 Manual Service
In Stock: 5845
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Bulk
Shipping DateNovember 6, 2024
* Quantity
Send Inquiry
Add To RFQ List
Related Parts
Bipolar Motor Driver CMOS SPI 24-SOIC
LCD Driver 32-QFP (7x7)
Linear Voltage Regulator IC Output
Linear Voltage Regulator IC Output
Supervisor Push-Pull, Totem Pole 1 Channel 5-TSOP
Supervisor Push-Pull, Totem Pole 1 Channel 5-TSOP
Supervisor Push-Pull, Totem Pole 1 Channel SC-82AB
Technical Specifications
Series-
Packaging
Bulk
Lifecycle StatusActive
Base Product NumberNCP302
Mounting StyleSurface Mount
Number of Voltages Monitored1
Operating Temperature-40°C ~ 125°C (TA)
OutputPush-Pull, Totem Pole
ResetActive Low
Reset TimeoutAdjustable/Selectable
Package Type (Mfr.)5-TSOP
TypeSimple Reset/Power-On Reset
Voltage - Threshold2.6V
Package / CaseSOT-23-5 Thin, TSOT-23-5
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
Extended Links
Datasheets
Environmental & Export Classifications
RoHS ComplianceNot RoHS compliant and cannot enter the EU market
MSL Level1 (Unlimited, ≤ 30°C/85% RH), No special packaging
REACH RegulationREACH Details Provided Upon Request
US ECCNEAR99
HTSUS8542.39.0001 (No rates found in the Harmonized Tariff Schedule)
Quality Inspection Records
The NCP302LSN26T1 (IC SUPERVISOR VOLT DETECT) passed the decapsulation and die inspection upon entering the Abrmicro warehouse on November 15, 2023. Decapsulation is a destructive test that physically opens the IC to inspect the die and internal structure for manufacturing defects or failure modes. The results showed no defects.
Abrmicro Laboratory