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MCP2210T-I/SSUSB Bridge, USB to SPI USB 2.0 SPI Interface 20-SSOP
1:$2.2400
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ABRmicro #.ABR753-MCP221-338036
ManufacturerMicrochip Technology
MPN #.MCP2210T-I/SS
Estimated Lead Time6 Weeks
SampleGet Free Sample
DatasheetMCP2210 (PDF)
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In Stock: 1388
Shipped From Shenzhen or Hong Kong Warehouses
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Packaging
Tape & Reel (TR)Cut Tape (CT)Abrmicro® Custom Packaging
Shipping DateDecember 24, 2024
* Quantity
Unit Price$2.2400
Ext. Price$2.2400
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
1$2.2400$2.2400
25$1.8640$46.5910
100$1.7010$170.1060
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
Series-
Packaging
Tape & Reel (TR)
Cut Tape (CT)
Abrmicro® Custom Packaging
Lifecycle StatusActive
Base Product NumberMCP2210
Supply Current13mA
FunctionBridge, USB to SPI
InterfaceSPI
Operating Temperature-40°C ~ 85°C
Parameter ProgrammingSupported
ProtocolUSB
StandardsUSB 2.0
Package Type (Mfr.)20-SSOP
Supply Voltage3.3V ~ 5.5V
Package / Case20-SSOP (0.209", 5.30mm Width)
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
Extended Links
Datasheets
Design Resources
Environmental Information
PCN Assembly/Origin
PCN Design/Specification
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level2 (1 Year, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCNEAR99
HTSUS8542.39.0001 (No rates found in the Harmonized Tariff Schedule)
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The MCP2210T-I/SS by Microchip Technology is a USB bridge that facilitates communication between USB 2.0 and SPI interfaces. Housed in a 20-SSOP package, this device can operate within a voltage range of 3.3V to 5.5V and has a current consumption of 13mA. It provides a straightforward solution for connectivity between devices using these two communication protocols, offering a reliable interface conversion with standard features necessary for embedded systems and electronic projects.
This information is sourced from the Internet, hasn't been reviewed, and may contain errors.