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THGAMVG9T23BAILFLASH - NAND Memory IC 512Gbit eMMC_5.1 200 MHz 153-BGA (11.5x13)

1:$21.2590

Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR2020-THGAMV-2739273
MPN #.THGAMVG9T23BAIL
Estimated Lead Time-
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In Stock: 21
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateNovember 3, 2024
* Quantity
Unit Price$ 21.2590
Ext. Price$ 21.2590
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
1$21.2590$21.2590
10$19.7970$197.9700
25$19.5850$489.6250
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Related Parts
FLASH - NAND Memory IC 256Gbit eMMC_5.1 200 MHz 153-BGA (11.5x13)
FLASH - NAND Memory IC 32Gbit eMMC_5 200 MHz 153-BGA (11.5x13)
FLASH - NAND Memory IC 64Gbit eMMC_5.1 200 MHz 153-BGA (11.5x13)
FLASH - NAND Memory IC 128Gbit eMMC_5.1 200 MHz 153-BGA (11.5x13)
FLASH - NAND Memory IC 256Gbit eMMC_5.1 200 MHz 153-BGA (11.5x13)
FLASH - NAND Memory IC 2Tbit UFS 3.1 1.16 GHz 153-BGA (11.5x13)
FLASH - NAND Memory IC 2Tbit eMMC 1.16 GHz 153-WFBGA (11.5x13)
Technical Specifications
Series-
Packaging
Tray
Lifecycle StatusEnd of Life (EOL)
Clock Frequency200 MHz
Memory FormatFLASH
Memory InterfaceeMMC_5.1
Memory Organization64G x 8
Memory Size512Gbit
Memory TypeNon-Volatile
Mounting StyleSurface Mount
Operating Temperature-20°C ~ 85°C (TC)
Package Type (Mfr.)153-BGA (11.5x13)
TechnologyFLASH - NAND
Supply Voltage2.7V ~ 3.6V
Write Cycle Time (Twc)-
Base Product NumberTHGAMVG9
Package / Case153-WBGA
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
Extended Links
PCN Obsolescence/ EOL
Environmental & Export Classifications
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
US ECCN3A991B1A AT
HTSUS8542.32.0071 (Other; No import duty applies)