32EM16-M4CTX29-8AD11FLASH - NAND, DRAM - LPDDR Memory IC 256Gbit (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 254-FBGA (11.5x13x1.0)
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ABRmicro #.ABR2020-32EM16-2820147
ManufacturerKingston Technology
MPN #.32EM16-M4CTX29-8AD11
Estimated Lead Time-
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Datasheet
32EM16-M4CTX29-8AD11 Datasheet(PDF)
32EM16-M4CTX29-8AD11 Datasheet(PDF)
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Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateNovember 3, 2024
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FLASH - NAND (TLC) Memory IC 256Gbit eMMC 153-WFBGA (11.5x13) Technical Specifications
SerieseMCP
Packaging
Tray
Lifecycle StatusObsolete
Memory FormatFLASH, RAM
Memory Organization-
Memory TypeNon-Volatile, Volatile
Mounting StyleSurface Mount
Operating Temperature-25°C ~ 85°C
Supply Voltage1.8V, 3.3V
TechnologyFLASH - NAND, DRAM - LPDDR
Memory Size256Gbit (NAND), 16Gbit (LPDDR4 DRAM)
Base Product Number32EM16
Memory InterfaceeMMC 5.1 HS400 + LPDDR4X
Package Type (Mfr.)254-FBGA (11.5x13x1.0)
Package / Case254-FBGA
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Datasheets
PCN Obsolescence/ EOL
EDA Models
Environmental & Export Classifications
US ECCNEAR99
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationPending Vendor Confirmation