CYG2010Telecom IC Data Access Arrangement (DAA) 18-DIP
N/A
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ABRmicro #.ABR702-CYG201-988758
ManufacturerIXYS Integrated Circuits Division
MPN #.CYG2010
Estimated Lead Time-
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Datasheet
CYG2031 (PDF)
CYG2031 (PDF)
For large-volume purchases, our unique channels enable us to provide prices that other suppliers cannot match: significantly below market rates.
Service
Guaranteed AuthenticityTechnical SupportFast RefundFree Shipping (over $960)Issue an Invoice24/7 Manual Service In Stock: 5
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tube
Shipping DateDecember 24, 2024
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Technical Specifications
SeriesCybergate™
Packaging
Tube
Lifecycle StatusObsolete
Supply Current8mA
FunctionData Access Arrangement (DAA)
Interface-
Mounting StyleThrough Hole
Number of Circuits1
Operating Temperature0°C ~ 70°C
Package Type (Mfr.)18-DIP
Supply Voltage5V
Package / Case18-DIP Module (0.850", 21.59mm), 11 Leads
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Datasheets
Environmental Information
Environmental & Export Classifications
RoHS ComplianceNot RoHS compliant and cannot enter the EU market
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationPending Vendor Confirmation
US ECCNEAR99
HTSUS8542.39.0001 (No rates found in the Harmonized Tariff Schedule)
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