AGFC023R25A2E1VQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point System On Chip (SOC) IC Agilex F FPGA - 2.3M Logic Elements 1.4GHz
1:$18346.4400
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ABRmicro #.ABR777-AGFC02-2314062
ManufacturerIntel
MPN #.AGFC023R25A2E1V
Estimated Lead Time20 Weeks
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Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateDecember 24, 2024
* Quantity
Unit Price$18346.4400
Ext. Price$18346.4400
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
3$18346.4400$55039.3210
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
Technical Specifications
SeriesAgilex F
Packaging
Tray
Lifecycle StatusActive
ArchitectureMPU, FPGA
Communication InterfacesEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size-
Number of I/Os480
Operating Temperature0°C ~ 100°C (TJ)
PeripheralsDMA, WDT
Primary AttributesFPGA - 2.3M Logic Elements
RAM Size256KB
Speed1.4GHz
Package Type (Mfr.)-
Package / Case-
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Environmental & Export Classifications
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
HTSUS8542.31.0070 (System on chip (SoCs); No import duty applies)
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