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CY8C4247AZI-L423ARM® Cortex®-M0 PSOC® 4 CY8C42xx-L Microcontroller IC 32-Bit Single-Core 48MHz 128KB (128K x 8) FLASH 48-TQFP (7x7)

1:$5.0260

Orders Over $2000 Receive a $100 Discount for Registered Abrmicro Users.
ABRmicro #.ABR2012-CY8C42-107558
MPN #.CY8C4247AZI-L423
Estimated Lead Time14 Weeks
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In Stock: 89
Shipped From Shenzhen or Hong Kong Warehouses
Min.&Mult.1
Packaging
Tray
Shipping DateNovember 3, 2024
* Quantity
Unit Price$ 5.0260
Ext. Price$ 5.0260
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* Prices exclude tax, and all prices are in USD.
Price Gradients
Qty.Unit PriceExt. Price
500$5.0260$2513.0000
* Prices are for reference only and are subject to change. Final sales prices will be confirmed at the time of purchase.
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Technical Specifications
SeriesPSOC® 4 CY8C42xx-L
Packaging
Tray
Lifecycle StatusActive
Base Product NumberCY8C4247
Communication InterfacesI2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Core ProcessorARM® Cortex®-M0
Core Size32-Bit Single-Core
Data ConvertersA/D 16x12b; D/A 2x7b, 2x8b
EEPROM Size-
MfrInfineon Technologies
Mounting StyleSurface Mount
Number of I/Os38
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeInternal
Parameter ProgrammingSupported
PeripheralsBrown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
Program Memory Size128KB (128K x 8)
Program Memory TypeFLASH
RAM Size16K x 8
Speed48MHz
Package Type (Mfr.)48-TQFP (7x7)
Supply Voltage (Vᴄᴄ/Vᴅᴅ)1.71V ~ 5.5V
Package / Case48-LQFP
Customize Part Specifications , or Contact Our Sales Representative to Obtain the Data You Desireinfo@Abrmicro.com
Extended Links
Environmental Information
Environmental & Export Classifications
RoHS ComplianceComplies with RoHS 3 Directive (2015/863/EU)
MSL Level3 (168 Hours, ≤ 30°C/60% RH), Vacuum Sealing
REACH RegulationNo SVHCs Present
US ECCN3A991A2 AT
HTSUS8542.31.0001 (No rates found in the Harmonized Tariff Schedule)
Quality Inspection Records
The CY8C4247AZI-L423 (IC MCU 32BIT 128KB FLASH 48TQFP) passed the Material Stress Testing upon entering the Abrmicro warehouse on September 7, 2023, confirming the mechanical properties of the packaging materials and die attachment (e.g., tensile strength, adhesion quality).
Abrmicro Laboratory