Maxim Integrated, a leading provider of analog and mixed-signal integrated circuits, follows a structured and standardized product naming convention for its wide range of integrated circuits. These naming rules help categorize products based on functionality, package type, temperature range, and the number of pins, ensuring clarity and consistency across the industry. This article explores the details of Maxim Integrated's product naming system, including suffixes, package types, and how they differentiate their non-proprietary offerings.

Maxim Integrated's product numbering system for integrated circuits

Maxim Integrated part numbers are prefixed with "MAX", and its products are divided into nine categories:
- MAX100-199: A/D converters
- MAX200-299: Interface products and analog filters
- MAX300-399: Analog switches and multiplexers
- MAX400-499: Operational amplifiers, buffers, and video amplifiers
- MAX500-599: D/A converters
- MAX600-699: Power supply circuits and voltage references
- MAX700-799: μP peripherals, DC-DC converters, and display drivers
- MAX800-899: μP monitors
- MAX900-999: Comparators

Maxim Integrated's suffix system for part numbers
- Three-letter suffix: For example, MAX358CPD
- C = temperature range
- P = package type
- D = number of pins

- Four-letter suffix: For example, MAX1480ACPI
- A = indicator level or additional function
- C = temperature range
- P = package type
- I = temperature range
Note: For interface products, if the first letter of the four-letter suffix is E, it indicates that the device has an antistatic function.

Temperature ranges
- C = 0°C to 70°C (commercial)
- I = -20°C to +85°C (industrial)
- E = -40°C to +85°C (extended industrial)
- A = -40°C to +85°C (aerospace)
- M = -55°C to +125°C (military)

Package Types
- A: SSOP (Shrink Small Outline Package)
- B: CERQUAD (Ceramic Quad Flat Package)
- C: TO-220, TQFP (Thin Quad Flat Package)
- D: Ceramic Copper Top Package
- E: QSOP (Quarter-sized Small Outline Package)
- F: Ceramic Flat Package
- H: Module Package, SBGA (Super Ball Grid Array), 5x5 TQFP
- J: CERDIP (Ceramic Dual In-line Package)
- K: TO-3 Plastic Lead Grid Array
- L: LCC (Leadless Chip Carrier Package)
- M: MQFP (Metric Quad Flat Package)
- N: Narrow Plastic Dual In-line Package
- P: Plastic Dual In-line Package
- Q: PLCC (Plastic Leaded Chip Carrier Package)
- R: Narrow Ceramic Dual In-line Package (300 mil)
- S: SOP (Small Outline Package)
- T: TO-5, TO-99, TO-100 (Transistor Outlines)
- U: TSSOP, µMAX, SOT (Small Outline Transistor)
- W: Wide SOP (300 mil)
- X: SC-70 (3-pin, 5-pin, 6-pin)
- Y: Narrow Copper Top Package
- Z: TO-92, MQUAD (Miniature Quad Flat Package)
- /D: Bare Die
- /PR: Enhanced Plastic Package
- /W: Wafer

Number of Pins
- A: 8
- B: 10, 64
- C: 12, 192
- D: 14
- E: 16
- F: 22, 256
- G: 24
- H: 44
- I: 28
- J: 32
- K: 5, 68
- L: 40
- M: 7, 48
- N: 18
- O: 42
- P: 20
- Q: 2, 100
- R: 3, 84
- S: 4, 80
- T: 6, 160
- U: 60
- V: 8 (round)
- W: 10 (round)
- X: 36
- Y: 8 (round)
- Z: 10 (circle)

Non-Proprietary Product Naming System
In most cases, Maxim Integrated uses the industry's widely accepted naming system for its non-proprietary products, which includes product grade, temperature range, package type, and number of pins. Maxim often offers product packages or temperature ranges that other manufacturers do not provide. When naming these products, Maxim adheres to the original industry naming system whenever possible.